Technical Capabilities (All values are in mm)
Specification
Value
Maximum no. of Layers
24
Maximum Board Thickness
3.20
Minimum Finished Board Thickness
0.20 (No HAL / Masking)
Circuit Layers (All values are in mm)
Specification
Value
For 0.5oz Copper Thickness
For Outer Layer - Minimum Track Width
0.09
For Outer Layer - Minimum Spacing
0.09
For Inner Layer - Minimum Track Width
0.125
For Inner Layer - Minimum Spacing
0.125
For 1.0 Oz. Copper Thickness
Minimum Track Width
0.15
Minimum Spacing
0.15
For 2.0 Oz. Copper Thickness
Minimum Track Width
0.175
Minimum Spacing
0.20
Drilling (All values are in mm)
Specification
Value
Minimum Finished Via Hole Size
0.15
Minimum via Pad Size
0.45
Outer Layers
0.40
Inner Layers
0.45
Minimum Annular Ring
0.10
Drill to Drill Clearance
0.15
Minimum Slot Size For PTH Slots (End size)
0.50
Blind & Buried vias Manufacturability
Yes
Drill to Track Clearance For Inner Layers (Std Spcl)
0.20
Drill to Track Clearance For Inner Layers (>4 Spcl)
0.25
Minimum Drill Size For Plated Holes on Board Edge
0.80
Minimum Drill to Drill Clearance For Plated Holes on Board Edge
0.20
Maximum Board Size (L x W) (All values are in mm)
Material
Value
FR4
430 x 585 (For SS & DS)
420 x 570 (For Multi layers)
420 x 570 (For Multi layers)
Rogers
435 x 275
Itera
430 x 585
MCPCB
430 x 585
Blind Vias Capabilities
Specification
Details
Maximum Supported Layers
Up to 24 layers with a maximum of 3 press cycles. (Extra press cycle refers to an additional step required for drilling blind or buried vias post lamination)
Maximum Number of Blind Vias Supported
Maximum 3 press cycles.
Via Size and Annular Ring
Min. 0.20 mm tool, 0.10 mm finished with 0.125 mm ring.
Max. 0.30 mm finished maintaining 1:8 aspect ratio.
Max. 0.30 mm finished maintaining 1:8 aspect ratio.
Supported Blind Via Types
We support only through drilling, no depth or laser drilling.
Base Materials
Specification
Value
Base Material
FR4
Inner Layer Copper Cladding
* Max. Cu Wt. For Planes (Oz.)
2
* Max. Cu Wt. For Signals (Oz.)
2
* Min. Cu Wt. (Oz.)
0.5
Outer Layer Copper Clading
* Max Cu Wt. (Oz.)
3
* Min Cu Wt. (Oz.)
0.5
Surface Finish
Specification
Value
HASL (Pb-Sn)
1 - 25 microns
HASL (Lead Free)
NA
Immersion Tin
NA
Electrolytic Nickel Gold (Hard Gold)
Gold thickness: minimum 0.5 microns
Nickel thickness: 3-5 microns
Nickel thickness: 3-5 microns
Electroless Nickel Immersion Gold (ENIG)
Gold thickness: minimum 0.04 microns
Nickel thickness: 3-5 microns
Nickel thickness: 3-5 microns
Technologies
Specification
Value
Impedance Control
Yes
Blind / Buried Vias
Yes
Carbon Printing
Yes
Hard Gold Tabs
Yes
Peelable Solder Mask
Yes